TFUER-T301 * Solder Pallet Materials T301 is a high-performance composite material specifically engineered for industrial and technical applications, including electronics, soldering, and assembly. Composed of fiberglass reinforcement and thermosetting resin, T301 is designed for use in demanding environments. It is commonly employed in a variety of applications, such as solder pallets, insulating boards, and heat-resistant surfaces in electronic manufacturing, due to its excellent durability, thermal stability, and resistance to mechanical stress. Key Features Heat Resistance: T301 materials are known for their ability to withstand extremely high temperatures, making them ideal for use in soldering applications where heat is a critical factor. Electrical Insulation: These materials offer good electrical insulation properties, making them suitable for applications where conductivity needs to be minimized. Mechanical Strength: T301 is designed to be durable, offering excellent mechanical strength and rigidity even at high temperatures. Chemical Resistance: These materials are also resistant to a wide range of chemicals and soldering fluxes, preventing corrosion and extending the lifespan of the products. Low Expansion: The materials have a low coefficient of thermal expansion (CTE), which means they resist deformation or warping under temperature changes, making them reliable for precision applications.